Decision to Discontinue the use of HMIS Ratings on Henkel NA Safety Data Sheets and Labels

Henkel PSRA NA has decided to discontinue the use of HMIS ratings on SDSs and labels. This change will be phased in beginning at the end of 2013 and fully effective June 1, 2015.

GAP PAD®, SIL PAD®, & HI-FLOW Ordering Information

GAP PAD®, SIL PAD®, & HI-FLOW Ordering Information

Integration of Bergquist Systems into Henkel SAP Systems

As you are aware, Henkel acquired The Bergquist Company in late 2014. Since then, Henkel has been integrating the Bergquist organization and analyzing the parallel IT systems in an effort to create minimal disruption once the IT systems are brought together

Solder Material Solutions

With solder solutions that span diverse applications within numerous market sectors, Henkel is the solder technology market leader.

The Game Changers - The First-Ever Temperature Stable Solder Pastes

The LOCTITE GC solder paste platform changes everything. Uniquely stable flux chemistry delivers unprecedented performance and is the basis of all LOCTITE GC materials, including the award-winning LOCTITE GC 10 and LOCTITE GC 3W.

Image of Henkel Bergquist's Gap Pad HC 5.0 Gap Pad HC 5.0 Publish Date: 2016-08-11

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.

Adhesive Electronics Technology Cluster Brands

Henkel has regrouped their product offering and introduced a simplified branding approach.

Solder Wire Solutions

The Multicore portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire.

Henkel Wins Pair of Circuits Assembly NPI Awards for New Product Innovations

Material Leader’s Latest Solder and Thermal Management Solutions Take Home Top Honors

Henkel Thermal Solutions for Any Application

Thermal Solutions for Any Application

Epoxy Flux Technology

Epoxy flux technology tacky flux with value added benefits from Multicore.

Advancements In Packaging Technology Driven By Global Market Return

Recently, the focus of attention in the IC packaging industry has been squarely on removing costs from the manufacturing supply chain

Loctite PowerstrateXtreme Printable from Henkel Raises the Bar on Thermal Management Flexibility

Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.

Henkel PowerstrateXtreme™ Dispensable from Henkel Delivers Benefits of Phase Change Materials in a Liquid Product

Henkel today announced the launch and commercial availability of its latest thermal product, PowerstrateXtreme™ Dispensable (PSX-D)

Henkel GC 10 Compatibility with Henkel Conformal Coatings Publish Date: 1970-01-01

Surface Insulation Resistance Testing Test Method IPC-TM-650 2.6.3.3

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Henkel's solder materials science gets small as miniaturization challenges old rules.

Lead-free for High-reliability, High-temperature Applications

Though the electronics industry is nearing the three-year anniversary marking the ban of lead from electronics products, several challenges remain with existing lead-free materials for certain applications from Henkel.

Henkel New Game Changing Solder Paste Wins NPI Award

LOCTITE GC 10 is the market’s first-ever temperature stable solder paste, an innovation that earned the material an NPI Award in the highly competitive solder materials category.