Parker Chomerics parts will include a -DK extension on all part numbers sold through DigiKey.
THERM-A-GAP™ thermal gap filler pads are soft and easily conformable to provide thermal interfaces between heat sinks and electronic devices, accommodating for uneven surfaces, air gaps, and rough surface textures.
CHO-THERM™ Thermal Dielectric Pads
Publish Date: 2020-02-28
This PTM defines what a Thermal Dielectric Pad is, what are the major product selection criteria, and a ranking based on the level of performance.
Duration: 5 minutes
How to Test a Thermal Interface Material
Publish Date: 2020-01-28
This presentation will explain how to test a thermal interface material from Parker Chomerics.
Duration: 10 minutes
THERM-A-GAP™ Thermally Conductive Gap Pads
Publish Date: 2020-01-24
This presentation will define what Thermal Gap Pads are, what the major product performance criteria used to make the material selection are, and rank the performance of each.
Duration: 5 minutes
CHO-MASK® II EMI Foil Tape
Publish Date: 2019-11-12
Parker Chomerics' CHO-MASK II is an EMI foil tape layered with polyester paint masking, providing a conductive non-corroding surface on electronic enclosures.
THERM-A-GAP™ GEL45 Thermally Conductive Gel
Publish Date: 2019-11-11
Parker Chomerics' THERM-A-GAP™ GEL45 dispensable thermal gel with 4.5 W/m-K thermal conductivity is a one-component fully cured system.
Automated dispensing of Parker Chomerics THERM-A-GAP™ Gel 45, which is a fully cured dispensable thermal gel that has 4.5 W/m-K thermal conductivity and is designed as a one component fully cured system.
For Thermally Conductive GELs, Cure-in-Place Potting Compounds and Greases
Products & Custom Solutions Catalog
Parker Chomerics THERM-A-GAP™ GEL30 is a fully cured dispensable gel with 3.5 W/m-K thermal conductivity. It is designed to eliminate time consuming hand assembly.
Automated dispensing of Parker Chomerics THERM-A-GAP™ TC50, which is a high performance, one component, dispensable thermal compound developed to conduct heat between a hot component and a heat sink or enclosure.
PREMIER™ A240-FRHF Conductive Plastic
Publish Date: 2019-08-23
Parker Chomerics' PREMIER™ A240-FRHF PC/ABS thermoplastic polymer alloys and conductive fillers are engineered for stable performance in diverse applications.
PREMIER™ PBT-225 Hydrolysis-Resistant Conductive Plastic
Publish Date: 2019-08-22
Parker Chomerics' PBT-225 hydrolysis-resistant conductive plastic is a high reliability, single-pellet material ideal for demanding electronics applications.
A computer hard drive manufacturer needs to cool the case temperature of two read/write chips adjacent to one another, to assure over 500k hour MTBF (mean time between failure).
