Thermal management of power electronics, whether power supplies or power components, requires interfacing the package to a heat sink using a thermal interface material (TIM).

Advanced communication technologies, motor controls, drives and power converters are delivering more function in smaller form factors, which raises power densities and increases heat generation.

Bergquist’s Gap Pad® TGP 6000ULM silicone-based, nonelectrically conductive Gap Pad is highly conformable, providing excellent coverage on various topographies.

Bergquist’s Gap Pad® TGP 7000ULM soft gap-filling material is rated at 7.0 W/m-K and formulated for high-performance applications requiring low assembly stress.

GAP PAD®, SIL PAD®, & HI-FLOW Ordering Information

As you are aware, Henkel acquired The Bergquist Company in late 2014. Since then, Henkel has been integrating the Bergquist organization and analyzing the parallel IT systems in an effort to create minimal disruption once the IT systems are brought together

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Determine the best solutions for your problems of LED implementation in whatever application you need from Bergquist.

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.

Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.

Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.

The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.

Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.

Many factors come into play in circuit design with respect to etching, surface finishing and mechanical fabrication processes; such as holes, flatness, singulation and tolerances.

Gain an understanding of gap filler materials from Bergquist in this application note.

Answer questions you may have about Gap Pads and their applications with this Bergquist FAQ.