Learn how multiradio wireless MCU modules accelerate the design, certification, and deployment of advanced multiprotocol IoT devices.
GMSL point-to-point link technology brings enhanced multi-camera video capabilities to industrial and automotive applications.
Combine advanced IMUs and other sensor types with sensor fusion for precise autonomous mobile robot (AMR) navigation in challenging environments.
A drop-in solution with edge AI enables immediate deployment of wireless condition-based monitoring with real-time notification of vibration anomalies.
An integrated 1000Base-T1 PHY transceiver and design resources combine to accelerate the design of real-time single-pair Ethernet systems.
A broad portfolio of AEC-Q200 parts meets diverse requirements for high performance, reliability, and safety in advanced automotive electronic subsystems.
Use ultra-low-power MCUs with specialized capabilities to meet application requirements without compromising processor performance or power budgets.
Use a compact, low-profile 5G MIMO antenna for effective connectivity while maintaining application discreetness and aesthetics.
Using a suite of highly integrated MCUs, developers can optimize their product designs for power, performance, security, and wireless connectivity.
Developers can use precision data acquisition modules and highly integrated IMUs to implement sophisticated and cost-effective avionics systems.
A set of devices simplifies the design of Ethernet connections capable of resisting surges associated with long cables between field sensors and hosts.
How to Quickly and Cost-Effectively Add Wireless Charging to Space-Constrained and Sealed Devices
Publish Date: 2023-12-20
A pair of devices simplify the design of wireless charging required in a growing class of space-constrained and sealed devices.
Use an Agile RF Transceiver in an Adaptive SDR Communication System for Aerospace and Defense
Publish Date: 2023-11-30
A fully integrated RF transceiver effectively meets the demand for high-performance agile SDR systems with reduced SWaP.
Build Connected Intelligent Field Instruments Quickly with Comprehensive Solution Sets
Publish Date: 2023-11-07
A comprehensive set of devices addresses requirements for sensor interfaces, processors, power, and connectivity in intelligent field instruments.
Ensure Connectivity in Harsh Environments with Bonded-Pair Ethernet Cables
Publish Date: 2023-09-26
Use bonded-pair Ethernet cables instead of twisted-pair cables to more effectively meet the electrical and physical challenges of industrial environments.
Speed Development of Long-Range Connectivity with a Certified LoRaWAN Module
Publish Date: 2023-08-24
Use a pre-certified LoRaWAN module to quickly deploy secure long-range connectivity for end devices.
How to Ensure Embedded System Security Using DSCs and MCUs Supported by Dedicated Security ICs
Publish Date: 2023-07-25
Use a combination of security ICs with high-performance DSCs and low-power MCUs to implement an effective embedded systems security platform.
How to Rapidly Deploy Edge-Ready Machine Learning Applications
Publish Date: 2022-08-04
The implementation of machine learning at the edge has been greatly simplified by NXP’s i.MX RT1170 Crossover MCU and associated board and software tools.
Hardware and software support for edge-based machine learning applications.
How to Quickly Launch 3D Optical Time-of-Flight Sensing Designs
Publish Date: 2022-04-26
Built around an integrated ToF sensor, an evaluation kit and associated software simplify development of 1D and 3D industrial sensing applications.