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ATS has the largest selection of pushPIN™ heat sinks on the market!

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pushPIN™ Heat-Sinks

pushPIN compression springs add the necessary force to hold the assembly together for secure attachment.

maxiFLOW™ pushPIN™ Heat Sink

maxiFLOW heat sinks include an integral pushPIN mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components.

maxiFLOW™ with maxiGRIP™ Heatsinks

BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

superGRIP™ Heat Sink Attachment System for Densely Populated PCBs

superGRIP heat sink clip attachment provides a strong hold with minimal space needed for components perimeter, ideal for densely populated PCBs.

maxiGRIP™ and superGRIP™ clipKITs™

maxiGRIP and superGRIP clipKITS offer patented superGRIP and maxiGRIP technology available for straight-fin, slant-fin, cross-cut, and pin-fin heat sinks.

blueICE™ Heat Sinks

High-performance blueICE heat sinks feature an ultra-low profile for tough-to-cool applications in tight-space applications.

Stamped Heat Sinks for TO Packages

ATS has introduced its stamped heat sinks, or board level cooling solutions, specifically designed to cool power modules that come in a variety of TO packages.

Brick Heat Sinks

ATS has produced a broad array of high performance heat sinks, based off of the patented maxiFLOW™ design.

Extrusion Profile Heat Sinks

Aluminum extrusions are cost-effective profiles that enable engineers to design from a pre-tooled extrusion profile for the cooling solution.