Board-Level Heat Sinks

ASSMANN WSW Components' line is suitable for semiconductor devices in D2Pak, SOT-32, TO-220, and TO-263 packages

Image of ASSMANN WSW Components' Board Level Heat SinksThe ASSMANN WSW line offers a selection of attachable, board-level heat sinks. The easy, time-saving assembly is the advantage of this generation. By pushing the heat sink onto the semiconductor housing, the cooling fingers form spring clamps which press the semiconductor housing onto the heat sink. Due to uniform pressure, optimal heat transfer will be realized. This series is offered in different lengths for varied dissipation. Due to the narrow version, this variation occupies very little space.

Features
  • Easy, time-saving assembly
  • Uniform pressure offers optimal heat transfer
  • Varied length options
  • Varied dissipation
Applications
  • Industrial process control equipment
  • Telecommunications equipment
  • Consumer products
  • Automotive

View All ASSMANN WSW Heat Sinks

Heat Sinks

ImageManufacturer Part NumberDescriptionAvailable QuantityPrice
HEATSINK ALUM ANODV5630-THEATSINK ALUM ANOD0 - Immediate$0.57View Details
HEATSINK TO-220 19.05X9.52MMV7235-THEATSINK TO-220 19.05X9.52MM0 - Immediate$0.44View Details
HEATSINK SOT-32 TO-220V9582X-LPHEATSINK SOT-32 TO-2200 - Immediate$0.99View Details

Heat Sink Accessories

ImageManufacturer Part NumberDescriptionAvailable QuantityPrice
HEAT SINK CLIP TO-220V25HKHEAT SINK CLIP TO-2200 - Immediate$0.26View Details
HEATSINK CLIP TO-220/TO-3/SOT-32V03HKHEATSINK CLIP TO-220/TO-3/SOT-320 - Immediate$0.16View Details
CLIP HEAT SINK ASST PKGSV11HKCLIP HEAT SINK ASST PKGS0 - Immediate$0.37View Details

Heat Sink Hardware

ImageManufacturer Part NumberDescriptionAvailable QuantityPrice
ROUND SPACER M3X0.5 BRASS 5MMV6254AROUND SPACER M3X0.5 BRASS 5MM0 - Immediate$0.28View Details
ROUND SPACER M3X0.5 BRASS 12MMV6254DROUND SPACER M3X0.5 BRASS 12MM0 - Immediate$0.66View Details
HEX STNDFF M2.5X0.45 BRASS 30MMV6622KHEX STNDFF M2.5X0.45 BRASS 30MM0 - Immediate$0.54View Details
Published: 2012-09-17