Chip Quik offers a Patent Pending Two-Part Mix solder paste. This unique solder paste has a 24-month shelf life either refrigerated or unrefrigerated before mixing. Once mixed, the solder paste can be dispensed by cutting a small corner off the bag. The bag can then be resealed with a piece of tape, or it can be stored by dispensing the entire bag into the provided empty jar. This solder paste is available in two alloys: Sn42/Bi57.6/Ag0.4 and Sn96.5/Ag3.0/Cu0.5, both with a synthetic no-clean flux type.
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- Two-year shelf life unrefrigerated before mixed
- Printing speeds up to 100 mm/sec
- Long stencil life
- Wide process window
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- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- RoHS II and REACH compliant
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