SW1 High-Current Wire-to-Board and Busbar Interconnects

Molex's receptacles provide low contact resistance and voltage drop for minimal heat generation

Image of Molex's SW1 High-Current Wire-to-Board and Busbar Interconnect Power efficiency is critical to cost and safety management in power-intensive applications within energy storage systems. SW1 receptacles incorporate Molex’s proven COEUR socket, which creates a large contact surface at the mating interface with its multiple contact beams, resulting in low contact resistance and voltage drop which leads to minimal heat generation.

Dense electronic packaging demands a low mated height between a cable assembly and its printed circuit board or busbar. SW1 receptacle assemblies are about 1/3 lower in height and 1/3 shorter in length than comparable solutions using hyperbolic sockets. The z-axis mating configuration is designed to eliminate cable bend radius complications, making it an ideal solution for applications where space is constrained.

It is a challenge to find a high-current, high-voltage interconnect that can attach to either printed circuit boards or busbars, accepts a wide range of wire gauges, and provides easy cable assembly management. SW1 offers locking pins that can attach to either printed circuit boards or busbars. The SW1 receptacle assemblies accept wire gauges ranging from 2 AWG to 4/0 AWG. SW1’s unique positive-locking design allows the cable assembly to rotate freely about the locking pin axis after mating, simplifying cable assembly dressing. The SW1 is available in three sizes: 6.00 mm (120.0 A), 8.00 mm (185.0 A), and 11.00 mm (300.0 A) with a unique positive-locking design for secure mating.

Industrial Automation Applications
  • Factory equipment
  • Robotics
Published: 2023-08-14