INNOVATIVE SOLUTIONS FOR SMALL DEVICES

TE Connectivity (TE) understands the significant design challenges high vibration, mechanical and thermal shock or EMI/RFI noise can present in small space applications. TE’s advanced technology in product development can help ease the transition to higher data rates, increased protection and smaller packaging with our industry leading components.

• Grounding
• Power
• Internal Interconnect
• I/O
• RF
• Card
• Circuit Management

Spring Fingers

• Small footprint allows for versatility in design on PC board
• Uses standard equipment for soldering and pick-and-place to help eliminate the need for expensive specialized equipment
• Scalable family with common footprint allows for quick design changes

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Battery Connectors

• Low profile design enables use in small factor devices allowing for design flexibility
• High current capacity enables battery connector to charge quickly
• Multi-directional mating allows for design flexibility when mating the battery to the desired board

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LCEDI Connectors

• Low profile height allows for design flexibility when configuring a PC board
• Full lock mechanism with pull bar is available to maintain greater mating retention
• Fully intermateable with I-PEX CABLINE-VS series to help standardize inventory

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AMPMODU System 50 Connectors

• Integral latches ensure a positive locking to the shrouded mating headers
• Housings on all board-mounted assemblies are made of high temperature tolerant materials and incorporate stand-offs for free drainage of flux cleaning solutions
• Ribbon cable connectors save board space

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Memory Sockets

• Allows replacement of central processing units without soldering process
• Automated socket placement during product manufacturing helps ensure a secure fit
• Able to withstand lead-free process temperature and compliant with environmental regulations

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Micro Mate-N-LOK Connectors

• Single-row and dual-row configurations are available to increase design flexibility
• Crimp, snap-in pin and receptacle contacts are used to terminate 24-20 [0.2-0.6] and 30-26 [0.05-0.15] AWG wire
• Header assemblies for wire-to-board interconnections include vertical and right-angle components

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USB 3.0 Connectors

• Minimizes user wait-time
• Backward compatible with USB 2.0 connector
• Minimize connector form factor variations
• Comprehend ease-of-use aspects
• Optimized power efficiency
• Plug and Play capacity

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CHAMP Connectors

• Strong sense of contacting from the side latches when pushing/pulling
• Signal/Ground to Conform EMI Prevention
• Miss-Insertion Prevented by Polarization and Guide Rail Equipped for Mating

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SMA RF Interconnects

• Fully compatible with IEC-169-15 standards
• Designed for 0-18 GHz performance
• Ability to mass customize products
• Global manufacturing footprints
• Large-scale manufacturing techniques
• Designed for fully automated assembly

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SD Card

• High-Speed data transfer rate
• Designed for ease of customer use with available push/push and push/pull mating
• Manufactured to meet existing SD memory card standards

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SIM Connectors

• Connector optimized for reliability (i.e., spherical contact points increasing hertz stress, pre-loaded contacts and anti retention features in the contacts)
• The SIM connector series offers the best possible design freedom; many products are even scalable in height within the same form factor
• Best possible applied cost by fully-automated processing

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Precision Resistors

• Ultra low temperature conditions allow for long term application stability
• Thin film precision resistors minimize electronic noise
• Flexibility in lead-time/packaging helps minimize inventory cost

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Tactile Switches

• High life cycle allows for a longer life expectancy for your applications
• IP 67 (sealed version) available to help prevent any potential liquid or particle contamination within the switch

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IM Signal Relays

• Slim line 10x6 mm, low-profile 5.65 mm and min. board-space 60 mm²
• Switching current 2/5 A, switching power 60 W/62.5 VA and switching voltage 220 VDC/250 VAC
• Low coil power consumption, 140 mW standard, 100 mW for high sensitive version, 50 mW for ultra-high sensitive version and 100 mW for bistable version

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