NTCC201 Leadless NTC Thermistor Die

Vishay’s NTCC201 series leadless NTC thermistor dies are suitable for sintering and wire bonding and deliver high sensitivity, high accuracy, and long-term stability over a wide temperature range up to +175°C. NTCC201 wire-bondable thermistors are ideal for temperature sensing, control, and compensation in IGBT/MOSFET and diode power module applications across many market segments. The bondable NTCC201 ensures excellent thermal coupling to the power component and in that way maximizes module performance and efficiency.

Vishay’s NTCC201 series of leadless thermistor die have top and bottom contacts of silver metallization, making them ideal for sintering and wire-bonding applications. The thick (10 µm min.) silver metallization is compatible with SAC/HMP reflow soldering and nano-silver paste sintering. This metallization is resistant to formic and forming gases covering all kinds of soldering types with or without the presence of flux. During power module mounting/washing, the components can withstand ultrasonic wave power without damage. The NTCC201 series offers high accuracy, long-term stability over a wide temperature range of -55°C to +175°C, a fast response time of three seconds, and AEC-Q200 qualification. The NTCC201 series features R25 values that are adapted to the resistivity of the thermistors' stable ceramic material, ultimately preserving its original electrical properties throughout its lifetime even at high temperatures, and is available in accuracies down to ±1%. The NTCC thermistor die is delivered in blister tape packaging for automatic mounting. The high temperature rating and long-term stability make the NTCC201 ideal for temperature sensing, control, protection, and compensation in high-power industrial and automotive applications. Specific applications include embedding the die in IGBT or POWER MOSFET power modules for H-EV, wind, solar power inverters, and protection circuitry for IC and semiconductor modules.