HF115AC-0.0055-AC-90 is out of stock and can be placed on backorder.
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HF115AC-0.0055-AC-90 | |
|---|---|
DigiKey Part Number | BER169-ND |
Manufacturer | |
Manufacturer Product Number | HF115AC-0.0055-AC-90 |
Description | THERM PAD 21.84MMX18.79MM W/ADH |
Manufacturer Standard Lead Time | 10 Weeks |
Customer Reference | |
Detailed Description | Thermal Pad Gray 21.84mm x 18.79mm Rectangular Adhesive - One Side |
Datasheet | Datasheet |
Product Attributes
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Category | Material Phase Change Compound |
Manufacturer Bergquist | Adhesive Adhesive - One Side |
Series | Backing, Carrier Fiberglass |
Packaging Bulk | Color Gray |
Part Status Active | Thermal Resistivity 0.35°C/W |
Usage TO-218, TO-220, TO-247 | Thermal Conductivity 0.8W/m-K |
Type Pad, Sheet | Shelf Life 12 Months |
Shape Rectangular | Shelf Life Start Date of Manufacture |
Outline 21.84mm x 18.79mm | Base Product Number |
Thickness 0.0055" (0.140mm) |
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Substitutes (1)
| Part Number | Manufacturer | Quantity Available | DigiKey Part Number | Unit Price | Substitute Type |
|---|---|---|---|---|---|
| A10832-02 | Laird Technologies - Thermal Materials | 0 | 926-1551-ND | $53.16000 | Similar |
In-Stock: 0
100 estimated in stock on 04-Dec-2026
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Quantity
All prices are in USD
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $2.19000 | $2.19 |
| 10 | $1.95700 | $19.57 |
| 50 | $1.75420 | $87.71 |
| 100 | $1.55180 | $155.18 |
| 500 | $1.34936 | $674.68 |
| 1,000 | $1.01202 | $1,012.02 |
| 5,000 | $0.87708 | $4,385.40 |
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