Winbond Electronics Corporation
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Winbond’s LPDDR4/4X 100BGA Achieves JEDEC Standard for Improved Energy Conservation and Carbon Reduction in a Smaller Package Size
Winbond’s new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction.
HyperRAM™ - Best DRAM choice for IoT application
For IoT applications, various design considerations such as low cost, low power consumption, and computing efficiency must be met in order to gain widespread adoption in the market. From the perspective of overall system design and product life, HyperRAM™ has become an ideal choice for emerging IoT devices.
Winbond Keeps Expanding DDR3 SDRAM Production
Winbond strengthens DDR3 SDRAM roadmap, production capacity and customer support to meet growing industry demand with ultra-high-speed performance.
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About Winbond Electronics Corporation
Winbond Electronics Corporation is a total memory solution provider. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
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PRESS RELEASES
- Winbond Earns ISO/SAE 21434 Certification for W77Q Secure Flash, Becoming the World's First Memory IC Vendor to Achieve this Milestone
- Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0
- Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices
- Winbond Introduces the Next Generation 8Mb Serial Flash for Edge Devices in Space Constrained IoT Applications
- Winbond Introduces the Next Generation 8Mb Serial Flash – W25Q80RV for Low Power and Small Form Factor IoT Devices
- Winbond joins STMicroelectronics Partner Program to Combine High-Performance Memory with STM32 Devices in Smart Industrial and Consumer Applications
- Winbond joins UCIe Consortium to Support High-Performance Chiplet Interface Standardization
- Winbond and Mobiveil Collaborate on Ultra-Low Power Applications
- Winbond Sets Global Sustainability Standard with Sustainability Initiatives and Products
- Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
