Samtec's SEARAY™ open-pin-field arrays are high-speed and high-density solutions offering maximum grounding and routing flexibility in 0.80 mm and 1.27 mm pitches.
Samtec’s Signal Integrity Group offers industry-leading SI/PI support locally and around the globe for free! Samtec’s team of technical experts advocates the ideal interconnect solution for your particular application and performance.
Samtec AcceleRate systems are high-speed, high-density board-to-board and cable assembly interconnects.
Precision RF and mm wave are typically for higher frequencies, usually rated at greater than 30 GHz. Samtec RF cable assemblies and board-level connectors are currently rated up to 110 GHz.
The PICMG COM-HPC specification target high performance computing for industrial applications. This new standard defines modules that typically plug into custom carriers.
Samtec Flyover QSFP Cable Assemblies have an ultra-high-density design that includes sideband signaling via press-fit contacts that help increase airflow.
The Samtec rugged discrete wire cable assemblies and components offer incredible space savings and design flexibility in cable-to-board, cable-to-cable and cable-to-panel applications.
Samtec AcceleRate® HD board-to-board system packs hundreds of I/Os in a compact footprint without sacrificing signal integrity. It is ideal in applications where extreme density and up to 56 Gbps PAM4 performance is required.
mPOWER® is the ultimate micro, high-power interconnect solution with incredible design flexibility for power-only or, power/signal applications by using alongside one of Samtec's high-speed connector systems.
Samtec designs and manufactures our own high-frequency, microwave/millimeter wave cables and connectors. In doing so, we're able to ensure the highest quality products that provide precise, repeatable electrical and mechanical results every time.
Samtec offers a full line of edge card connectivity solutions for industries and applications including datacom, industrial, high-performance computing, and the PCI Express® market, along with a product roadmap to support 56 Gbps speeds and beyond.
High cycle, high speed, high power, and harsh environment solutions that maximize space within a system. This includes IP68 & IP67 Sealed, Flexible Power, Rugged Signal Integrity, and Rugged Contact System designs.
From standard products to unique high-performance designs, Samtec’s offering is designed to support any interconnectivity need, regardless of application, performance requirements or environment.
XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. Visit samtec.com/XCedeHD for more information.
This brief video showcases our emerging backplane technology in our new ExaMax system capable of 28+ Gbps while providing reliable contacts and low mating force. Visit samtec.com/ExaMax for more information.
Mitigating damage to components, boards and solder joints in high-normal-force applications, our jack screw standoffs can be applied to 15.24 mm board stack heights.
As an interposer, Z-Ray® is a cost-saving removable interface between the IC package and main board. Z-Ray® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.
Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open pin field arrays. They support 28+ Gbps applications and feature a .050" x .050" pitch grid for maximum grounding and routing flexibility.
Video has transformed from being an analog 6 MHz bandwidth signal to a 12 Gbps digital data stream. As signaling transitioned to 12 Gbps 4K UHD-SDI standards, the demand for meeting stringent return loss requirements up to 12 GHz emerged.
There are plenty of variables to consider when designing, prototyping, and producing your design. From EMI, to cross-talk, to skew rate, potential problems in high speed applications can seem endless.
