Winbond’s HYPERRAM™ is optimized for the growing AIoT applications including transportation, factories, and smart home. HyperRAM provides design simplicity, space saving, and low power operation while delivering the performance needed.
Winbond High Performance Serial NAND (QspiNAND) offers reliable, lower-cost alternative to SPI NOR Flash in 1Gbit and 2Gbit capacities with a maximum data transfer rate of 166MB/s for automotive displays and instrument clusters.
Winbond’s SpiStack® W25M Memory Series for “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and data storage, while providing designers with flash solutions for their design requirements.
A specialized processor and software library offer a simpler, safer alternative for face-based authentication.
Designers can use a wireless SoC’s specialized power management technology to support continuous Wi-Fi connectivity at minimal current levels.
W25Q512JV 512 Mb Serial Flash Memory
Publish Date: 2019-12-03
Winbond's W25Q512JV (512 Mb) serial Flash memory provides a storage solution for systems with limited space, pins, and power.
Serial Flash Memory Part 1: SPI Interface
Publish Date: 2019-10-28
This presentation will review the operation, performance and use cases for serial flash interfaces while concentrating on Serial Peripheral Interface or SPI.
Duration: 5 minutesDevelopers can rapidly implement machine learning based speech and object recognition designs using MicroPython and a neural network processing module.
SDRAM Memory Basic Introduction
Publish Date: 2018-07-23
This presentation will highlight Winbond’s SDRAM Memory Basic Introduction.
Duration: 10 minutesThe Industrial IoT requires designers to pay particular attention to architecture, device reliability and robustness, and connectivity.
W25N QspiNAND Flash
Publish Date: 2017-01-25
Winbond’s SLC NAND Flash products are direct drop-in replacements to the ONFi SLC NAND products available in the industry from different suppliers and the products are compatible.
Specialty DRAM and Mobile DRAM Products
Updated: 2020-05-22
Winbond is one of the world’s major DRAM suppliers focusing on embedded designs and mobile markets.
W25 SpiFlash® Series
Publish Date: 2017-01-25
Winbond's W25X and W25Q SpiFlash® multi-I/O memories feature the popular serial peripheral interface (SPI), densities from 512 K-bit to 512 M-bit, small erasable sectors and the industry's highest performance.
IoT apps demand connectivity straddling both industrial and consumer communications requirements. Multi-standard wireless MCUs now offer more these options.
Analog transducers and sensors do a good job of translating a real world physical condition into an electronic signal that we can measure and use.
Digi-Key Corporation and Winbond Electronics Corporation America announce the expansion of the companies' current distribution agreement to include Europe.
Specialty and mobile DRAM SDR, DDR, DDR2, DDR3 from Winbond.
Winbond Electronics Corporation
Winbond Electronics Corporation America (WECA) was founded in 1990. It is the sales, marketing and design arm for Winbond Electronics Corporation, headquartered in Science-Based Industrial Park, Hsinchu, Taiwan.
