Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
Filter Similar Products
Show Empty Attributes
Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
Report Product Information Error
Documents & Media
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 0
756 estimated in stock on 04-Jan-2027
Request Stock Notification
Non-Cancelable/Non-Returnable
Quantity
All prices are in USD
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $3.50000 | $3.50 |
| 10 | $3.09600 | $30.96 |
| 25 | $2.94960 | $73.74 |
| 50 | $2.84300 | $142.15 |
| 100 | $2.74020 | $274.02 |
| 250 | $2.60996 | $652.49 |
| 648 | $2.48096 | $1,607.66 |
| 1,296 | $2.39100 | $3,098.74 |
Tariff Status: Tariff may apply if shipping to the United States. Estimated tariff costs will be calculated and displayed in the shopping cart to help you assess potential expenses.
You May Also Be Interested InSee All
5 Items
