374324B60023G is out of stock and can be placed on backorder.
Available Substitutes:

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Advanced Thermal Solutions Inc.
In Stock: 0
Unit Price: $8.83000
Datasheet
Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
374324B60023G
374324B60023G

374324B60023G

DigiKey Part Number
HS522-ND
Manufacturer
Manufacturer Product Number
374324B60023G
Description
BGA HEAT SINK
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Datasheet
 Datasheet
Product Attributes
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Category
Length
1.063" (27.00mm)
Mfr
Width
1.063" (27.00mm)
Series
Fin Height
0.394" (10.00mm)
Packaging
Bulk
Power Dissipation @ Temperature Rise
1.5W @ 50°C
Part Status
Active
Thermal Resistance @ Forced Air Flow
6.00°C/W @ 500 LFM
Type
Board Level
Thermal Resistance @ Natural
30.60°C/W
Package Cooled
Material
Attachment Method
Solder Anchor
Material Finish
Black Anodized
Shape
Square, Pin Fins
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
Substitutes (1)
Part NumberManufacturerQuantity AvailableDigiKey Part NumberUnit PriceSubstitute Type
ATS-55270D-C1-R0Advanced Thermal Solutions Inc.0ATS1269-ND$8.83000Similar
In-Stock: 0
216 estimated in stock on 04-Jan-2027
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Non-Cancelable/Non-Returnable
All prices are in USD
Bulk
QuantityUnit PriceExt Price
1$3.71000$3.71
10$3.28100$32.81
25$3.12520$78.13
50$3.01220$150.61
216$2.78699$601.99
432$2.68609$1,160.39
648$2.62873$1,703.42
1,080$2.55816$2,762.81
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