ATS’s maxiFLOW heat sinks provide one of the highest thermal performance for the physical volume it occupies as compared to other heat sink designs. The patented, flared fin design reduces junction temperatures by more than 20% compared to standard straight fin, pin fin, or folded fin designs. maxiFLOW heat sinks are ideally suited to meet the thermal requirements of a broad range of electronic packages, including: BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP.