The LT3652 is offered in the compact and thin 12-lead, 3mm x 3mm leadless DFN package with a thermal pad underneath for maximum thermal performance. This figure illustrates the pin configuration and footprint of this device.
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The LT3652 is offered in the compact and thin 12-lead, 3mm x 3mm leadless DFN package with a thermal pad underneath for maximum thermal performance. This figure illustrates the pin configuration and footprint of this device.
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