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Product List
ST offers flexibility the to integrate IPD into an application. On this slide is shown the different packaging options available. IPD can be wire-bonded to another substrate for a system-in-package application. These devices can also be provided in µbumped die which is also suitable for system-in-package integration. The other option is to have the IPD in a regular bumped die, with a total thickness less than 650 µm. This type of package is suitable for stand-alone passive applications.
PTM Published on: 2013-02-27
