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Product List
An additional layer of defense for the best possible reliability is ATP’s System-In-Packaging (SIP) manufacturing process. ATP’s SIP process fully encapsulates all the components inside a single molding housing. This means there are no points of failure since no components are exposed. This results in ATP’s NAND solutions being water proof, dust proof, ESD resistant and shock resistant.
PTM Published on: 2015-10-20
