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Another advantage of ROHM’s product is the miniaturization of package size while still supporting high input voltage and high output current capability. Comparing the evolution of package size, ROHM’s products now come in tiny flip-chip 2 mm x 2 mm packages that are 86% smaller than traditional packages. Flip-chip packaging technology allows for better thermal performance and smaller parasitic in a smaller footprint.
PTM Published on: 2022-09-26
