The slide here provides an overview of the technical challenges addressed by using the Game Changer 3W paste. With improved fine pitch and small feature printability, defects such as bridging and insufficient paste are minimized. Generally hard to wet metalizations require more activators, but higher activity solder pastes tend to have a shorter shelf life. Improved reflow performance better accommodates hard to wet metalizations and coalescence of small paste deposits reflowed in air. Ease of cleanability of flux residue. Stability and long shelf life ensures a consistent and reliable paste throughout storage to the consumption of stock material.