The same paste deposits as seen in the previous slide are shown here after reflow. The molten solder has fully wetted the pads and component surfaces. The solder joint surface is smooth with no signs of graping or non-coalescence, which is a typical defect when reflowing very small paste deposits in air. Reflow under an inert nitrogen blanket is one solution to correct this type of defect, which is not required when using GC 3W.