NSP-25 Non-Silicone Putty
T-Global Technology
The purpose of this presentation is to introduce NSP-25, T-Global non-silicone putty which has been specifically designed for the automotive industry. This module will introduce the key properties of the product line, identify some of the key design criteria for product selection, and present the value proposition for this product.
Related Parts
| Imagen | Número de pieza del fabricante | Descripción | Tamaño/Dimensión | Rango de temperatura usable | Cantidad disponible | Precio | ||
|---|---|---|---|---|---|---|---|---|
 |  | TG-NSP25-60 | SILICONE FREE THERMAL PUTTY 60CC | Envase de 60 cc | -58°F ~ 302°F (-50°C ~ 150°C) | 0 - Inmediata | View Details for Pricing | Ver detalles |
PTM Published on: 2013-04-18
