Nexperia's e-mode GaN FETs are designed for low- or high-power conversion applications, offering enhanced power system flexibility.

Nexperia’s Energy Harvesting PMIC uses the advanced Maximum Power Point Tracking (MPPT) algorithm to harvest energy for ultra-low power IoT sensors/nodes. MPPT uses an embedded hill-climbing algorithm to deliver the maximum power to the load.

The Nexperia Recovery Rectifiers deliver a high power density while minimizing reverse recovery time and loss.

Power GaN FET devices can bring multiple benefits to power electronic converters, join Ilian as he compares traditional Silicon-based converters to a GaN-based converter, highlighting the key benefits Power GaN FETs bring to your system.

Presentation on the quality and reliability of Nexperia GaN products.

Leaning on Nexperia's expertise in copper clip technology, Ding Yandoc (Package Architect and Technical Manager) explains all you need to know about CCPAK and why it is the logical next step in high-voltage power FET packaging.

Nexperia trench Schottky rectifiers in clip-bonded FlatPower packages meet the challenging demands of efficient and space-saving designs.

Automatic Optical Inspection (AOI) is key to PCB assembly because it verifies the quality of the solder joint, thereby ensuring the robustness of the PCB. If AOI fails to correctly verify the solder it results in a loss of time and money.

Nexperia’s Trench Schottky rectifiers offer excellent switching behavior and low conduction losses, leading thermal performance and extended safe operating area. Making them the ideal choice for automotive applications.

The CFP15B clip-bond FlatPower package is engineered for maximum robustness and reliability under the toughest conditions, making it ideal for automotive applications.

Join Ding as he explains all you need to know about Nexperia's LFPAK56D half-bridge package, PCB connection options, package concept, and key features.

Join Richard as he talks through three MOSFET packages that best fit into the low/medium power automotive motor control application space, discussing the highs and lows of each.

Silicon Germanium (SiGe) rectifiers deliver cutting-edge high efficiency, thermal stability and space-savings. Nexperia’s SiGe rectifiers combine the high efficiency of Schottky rectifiers with the thermal stability of fast recovery diodes.

Nexperia’s silicon-germanium rectifiers provide high efficiency in a small form factor package that provides excellent electrical and thermal performance.

Nexperia’s TrEOS technology optimizes the three pillars of ESD protection: Low capacitance for highest signal integrity, Low clamping and trigger for enhanced system protection, and High robustness against ESD and Surge transients.

High ESD robustness is key to ensuring the reliable, high performance of automotive applications. The trend toward increasing data payload in vehicles due to electrification and connectivity challenges hardware engineers with ESD robustness decrease.

As designs get smaller there is an increasing demand for MOSFETs to have high power capabilities in smaller packages. Reducing the size of components has a great impact on thermal management, as power dissipation must occur on smaller die sizes.

To satisfy an ever-increasing number of electronic functions, vehicles require more semiconductor components. Watch how Nexperia’ s AEC-Q101 qualified leadless packages with side-wettable flanks help save space and minimize weight.

Nexperia’s AEC-Q101 qualified leadless packages with side-wettable flanks help save space and minimize weight while ensuring the performance and efficiency of these components – especially at high temperatures.

Join Stein Nesbakk as he explains for which applications SOA is vital, but also how to achieve the balance between low RDS(on) and strong SOA.