In summary, this module has covered the Thermal Clad® insulated metal substrate (IMS®) which quickly transfers heat to the aluminum base. This module also reviewed circuit board types and mounting techniques as well as the T-Clad PA-Bond-Ply 450 which is a pre-applied, highly thermally conductive adhesive tape. For more information, please visit The Bergquist Company at www.bergquistcompany.com.