CUI Devices' stamped and extruded heat sinks are compatible with TO-218, TO-220, TO-252, and TO-263 transistor package types and come in a variety of standard shapes and sizes. Ideal for improving the heat dissipation of both low and high power board level designs, CUI Devices' aluminum and copper heat sinks are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal extrusion or stamping for natural convection or forced air cooled systems.