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Product List
This study was conducted by comparing a 6-pin SOT886 MicroPak to a six ball WCSP package. Both parts have the same size and footprint. They are mounted on a PCB by using the same solder mask for both packages. The solder mask layout is the recommended footprint for the WCSP package. It is therefore not optimized for the MicroPak.
PTM Published on: 2011-11-02
