HF212 is a lead-free solder paste formulated to the most stringent performance requirements. It meets the proposed IPC definition of a halogen-free material, while maintaining the reflow performance of a halide-free material. Being formulated with a type 4 powder allows the HF212 paste to be used to print high-density fine-pitch components. The print life time has been determined to be in excess of 8 hours. The reflow performance is excellent across a wide range of profiles and component surface finishes including the challenging nickel copper zinc finishes on RF shields. The ability of the HF212 to withstand long hot profiles means that this product can be used not just on small low thermal mass boards but medium and large thick boards which require more heating. The residues after reflow are clear and colorless, making joint inspection easy. The low voiding characteristics of the HF212 make it ideal for fine-pitch CSP and micro BGA components as well as QFNs.