MP218 is the key no-clean flux medium for Henkel’s leaded alloys. The product has been formulated to be resistant to a wide variety of environmental conditions, making it easy to use year round. The flux residues after reflow are colorless, making the visual appearance of the finished assembly clean. The process window for printing allows for high-speed printing for high-volume applications while the reflow process window has been extended to lead-free profiles which can be run with this paste, should the choice of components require it. The post reflow residues are soft enough to allow pin probing for in circuit testing (ICT). Finally the residues have been tested and show to meet and surpass all the industry standard reliability requirements.