In summary, Henkel’s solder paste presentation covered the basics of solder paste and how it’s used in today’s applications. Additionally, it covered the functions of the flux medium used in a solder paste, the alloys and particle distributions available, the chemistries commonly used, and finally the printing and reflow process that is typically used to form a functional and reliable solder joint. Finally, a brief summary of push products offered by Henkel through the Multicore line of products was presented.