This slide shows examples of 0.5 mm CSP printed solder paste which is reflowed using the shorter linear type and long hot soak type profiles. Pictured in the top row is the linear profile used to reflow GC 10 and several comparison pastes, some of which contain halogen. All pastes show acceptable solder joint appearance. The bottom row illustrates what can happen to many solder pastes using a long-soak profile type. Often the fluxing capacity is consumed, also called “flux exhaustion”. This results in a dull solder surface appearance and poor coalescing of solder powder, also known as “graping”.