Conditioning at 40°C for two months is an accelerated aging test, designed to determine if there would be any change in paste performance should it be exposed to elevated temperatures for a brief period, as in the case of ground shipping conditions in very warm climates. No change in paste performance was observed. Good print performance was achieved after paste conditioning on a 0.4 mm pitch BGA device. Paste volume transfer was very consistent during printing and also after abandon times. Also, no change in reflow performance was observed. Solder joints were shiny and smooth all small devices.