This slide provides an overview of the technical challenges associated with a stable paste that also has superior solderability performance. With improved fine pitch and small feature printability, defects such as bridging and insufficient paste are minimized. Generally, hard to wet metallizations require more activators, but higher activity solder pastes tend to have a shorter shelf life. Improved reflow performance better accommodates hard to wet metallizations, such as CuNiZn as found on RF shields, and coalescence of small paste deposits reflowed in air. Stability and long shelf life ensures a consistent and reliable paste throughout storage to the consumption of stock material.