The same previous paste deposits are shown on this slide, after reflow. The molten solder has fully wetted the pads and component surfaces. The solder joint surface is shiny and smooth with no signs of graping or non-coalescence, which is a typical defect when reflowing very small paste deposits in air. Reflow under an inert nitrogen blanket is one solution to correct this type of defect, which is not required using GC 10.